Windows 10 News and info | Forum
July 13, 2020, Loading... *
Welcome, Guest. Please login or register.

Login with username, password and session length
News: This is a clean Ad-free Forum and protected by StopForumSpam, Project Honeypot, Botscout and AbuseIPDB | This forum does not use audio ads, popups, or other annoyances. New member registration currently disabled.
  Website   Home   Windows 8 Website GDPR Help Login Register  
By continuing to use the site or forum, you agree to the use of cookies, find out more by reading our GDPR policy.
Pages: [1]
Share this topic on Del.icio.usShare this topic on DiggShare this topic on FacebookShare this topic on GoogleShare this topic on MySpaceShare this topic on RedditShare this topic on StumbleUponShare this topic on TechnoratiShare this topic on TwitterShare this topic on YahooShare this topic on Google buzz
Author Topic: Intel to begin shipping Ice Lake this June, 7nm products coming in 2021  (Read 452 times)
Hero Member
Offline Offline

Gender: Male
United States United States

Posts: 31579

I Do Windows

WWW Email
« on: May 09, 2019, 01:11:11 PM »

Intel held its 2019 investor meeting today, and the company's Chief Engineering Officer, Murthy Reduchintala, took the stage to reveal more details about the plans for upcoming processor technologies. Reduchintala talked about the impending 10nm architecture, but also shared details of Intel's 7nm process for the first time.

Starting with the long-anticipated processors built on the 10nm process, which are codenamed Ice Lake, it was revealed that Intel will start shipping them in June. As previously announced, this will allow computer manufacturers to have computers with the new processors by the holiday season. Intel promises three times the wireless speed, two times the speed for video encoding and graphics, and 2.5 to 3 times the speed for artificial intelligence when compared to the previous generation.

Intel also has a bunch of other products based on the 10nm process in the pipeline for 2019 and 2020, including client and server processors, new FPGAs, a general-purpose GPU, and more.

Looking onward to the 7nm process, Intel says it will deliver twice the scaling and 20% more performance per watt. It also promises a four times reduction of design rule complexity, and it'll be the first time Intel is using extreme ultraviolet (EUV) lithography, which will help drive scaling for "multiple node generations".

The most notable product to be released with this architecture is a Xe-family general purpose GPU, which is expected to arrive in 2021. It will be meant for data center AI and high-performance computing tasks.

Intel also talked a bit more about its Lakefield packaging technology, which it first showed off at CES this year. Intel says Lakefield should deliver up to ten times better power consumption in standby and 1.5 to 2 times better active power consumption. It also promises twice the graphics performance and a reduction in PCB by up to half.


Pages: [1]
Jump to:  

Powered by SMF 1.1.21 | SMF © 2017, Simple Machines

Google visited last this page April 26, 2020, 08:07:58 PM