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Author Topic: Intelís 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets,  (Read 79 times)
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« on: June 11, 2020, 02:09:31 PM »
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Intelís 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ultraportable, foldable, and dual-screen devices in what might be Intelís best answer yet to ARM.

The new ďIntel Core processors with Intel Hybrid TechnologyĒ (an official name that almost guarantees that people will continue to refer to them as Lakefield chips) debuts two major technologies on its chipsets for the first time: hybrid cores and a more compact stacked Foveros 3D design.

The new chips are designed to power smaller, ultralight devices, the first three of which have already been announced: the Intel version of the Galaxy Book S (which previously had an ARM model powered by a Qualcomm Snapdragon 8cx), the foldable Lenovo ThinkPad X1 Fold, and the dual-screen Surface Neo.

The hybrid core setup works by combining a more powerful Core-class Sunny Cove core (the same 10nm architecture the 10th Gen Ice Lake chips are based on) with four low-power Atom-class Tremont cores (for a total of five cores and five threads) on a single die. That arrangement allows for a balance of power, efficiency, and battery life that a purely Core or purely Atom setup could achieve.

If that sort of chipset arrangement sounds familiar, thatís because itís strikingly similar to ARMís Big.Little architecture, which is used by Qualcommís Snapdragon, Samsungís Exynos, and Huaweiís Kirin chipsets for mobile phones, tablets, and even laptops. In other words, the new Lakefield chips represent Intelís best efforts to face off against ARM chipsets for ultra-portable laptop and tablet form factors.

And thatís where the other big innovation on the Lakefield chips comes in: Intelís 3D Foveros stacking technology, which allows for a far more compact package than traditional designs. The Lakefield chipsets are broken up into three layers. Two are logic dies, which contain the five CPU cores, Intelís integrated UHD Graphics GPU, and the various I/O elements needed for a computer to work. The third bundles in DRAM, which help further cut down on space. All told, Intel says that the new Lakefield chips take up to ď56 percent smaller package area for up to 47 smaller board sizeĒ compared to an Intel Core i7-8500Y processor.

To start, Intel is debuting two 7W Lakefield chips: the Core i5-L16G7 and the Core i3-L13G4. And since they share an architecture with Intelís latest 10th Gen Ice Lake chips, both of the new chipsets also benefit from common features, like Intelís Gen11 integrated graphics and support for Wi-Fi 6. The Core i5-L16G7 is obviously clocked faster, with a 1.4GHz base frequency, 3.0GHz single-core turbo boost speed, and 1.8GHz all-core frequency. The Core i3-L13G4 has a base frequency of 0.8GHz, a 2.8GHz single-core turbo boost speed, and 1.3GHz all-core frequency.

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