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General Category | GDPR - Important notice => Patents, Software Patents, Patent applications => Topic started by: javajolt on June 22, 2018, 02:26:39 PM
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Microsoft has a long history of creating new products category, and the company has already patented some innovative projects, like dual-screen and hinge tech for Andromeda.
A report earlier this month revealed that Microsoft will adopt the USB-C tech again, and the future Surface lineup might soon come with USB-C.
A new patent published on June, 21 suggests that the Redmond-based tech giant Microsoft is working on devices with USB Type C, and it will be thinner than the devices with traditional USB output. This makes sense given that USB-C is becoming a more widely-used standard, and interestingly, Microsoft has improved the design of USB-C port in order to make its devices thinner.
The patent titled “ULTRA-THIN USB-C CONNECTOR (http://pdfaiw.uspto.gov/.aiw?PageNum=0&docid=20180175567&IDKey=A764687C6AB0&HomeUrl=http%3A%2F%2Fappft.uspto.gov%2Fnetacgi%2Fnph-Parser%3FSect1%3DPTO1%2526Sect2%3DHITOFF%2526d%3DPG01%2526p%3D1%2526u%3D%25252Fnetahtml%25252FPTO%25252Fsrchnum.html%2526r%3D1%2526f%3DG%2526l%3D50%2526s1%3D%25252220180175567%252522.PGNR.%2526OS%3DDN%2F20180175567%2526RS%3DDN%2F20180175567)” explains how the devices with this new UBS-C connector could get thinner. This would be particularly useful in the case of the rumored Microsoft’s affordable Surface tablets which the company is reportedly preparing for the summer launch.
(http://s22.postimg.cc/ggar3npq9/Microsoft-_USB-_Patent.jpg)
It appears that such a device with the improved USB-C connector would look thin
“The USB-C connector includes a single, seamless, continuous, thin housing protecting a wire termination and contacts within the housing. The housing has a uniform thickness along the entire length of the housing,” the company explains in a patent filing.
“The housing may provide strain relief to the cable and an aesthetically pleasing USB-C connector. The connector may include an overmold residing inside the housing and over the wire termination and contacts,” Microsoft explains.
source (http://www.windowslatest.com/2018/06/22/microsofts-new-patent-reveals-how-devices-with-usb-type-c-could-get-thinner/)